What is COB (Chip on Board) ?
Chip on Board (COB) refers to the latest LED packaging technology where the LED light-emitting chip is directly bonded onto the PCB board, with the entire board sealed with epoxy resin to reduce the risk of wire bonding and improve stability. Features ultra-wide viewing angle and strong protection.
OUR FEATURES
Product Derivatives – SMD/COB Anti-Collision Comparison Chart
SMD LED Displays: SMD (Surface-Mounted Device) LED displays offer high brightness and color accuracy, with each LED chip mounted on the surface of the PCB, making them ideal for both indoor and outdoor high-resolution applications.
COB LED Displays: COB (Chip on Board) LED displays provide superior thermal management and efficiency by directly mounting LED chips onto the PCB, which enhances robustness and uniform light distribution, suitable for demanding environments.
SMD and COB Process Comparison
SMD
Process Characteristics: Surface mount technology for LED chips.
Applicable Range: Wide range, covering both indoor and outdoor LED displays.
COB
Process Characteristics: Directly welds the LED light-emitting chip onto the PCB board, with the entire board sealed with epoxy resin to reduce the risk of wire bonding and improve stability. Features ultra-wide viewing angle and strong protection.
Applicable Range: Suitable for micro-pitch products such as 0.6, 0.7, 0.93, 1.25 mm, etc.
SMD and COB Process Comparison
SMD Component Packaging: SMD LEDs feature a LED chip connected to a PCB using gold wires and encased in epoxy resin, providing high brightness and color accuracy for both indoor and outdoor high-resolution displays.
Flip Chip COB (Chip on Board): COB LEDs have the chip directly mounted onto the PCB with encapsulation glue, offering superior thermal management and efficiency, making them ideal for applications requiring robust performance and uniform light distribution.
Feature Comparison between SMD and COB LEDs
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